From: Rortvedt deZero <rortvedt**At_Symbol_Here**HOTMAIL.COM>
Subject: [DCHAS-L] Plasma etcher
Date: July 5, 2012 4:10:41 PM EDT
Reply-To: DCHAS-L <DCHAS-L**At_Symbol_Here**MED.CORNELL.EDU>
Message-ID: <1B4D1665F78352429F7714A6540EB036294461CD**At_Symbol_Here**MBXE-01.exchange.cornell.edu>


 

One of our researchers will get a plasma etching system. The manufacturer mentioned that a scrubber may be required on the vacuum line when he uses CF4 and produces SiF4.

Is anyone familiar with these devices who can provide safety/environmental/waste guidance?

Are the levels of SiF4 high enough to affect the ventilation system?

Thanks.

Ralph North, CHMM
Environmental Affairs Specialist
University of Wisconsin System
Office of Safety and Loss Prevention
780 Regent St.
Madison, WI 53715-2635
rnorth**At_Symbol_Here**uwsa.edu
(608) 263-4419

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